Mechanical Design of IC Packaging Seminar
OBJECTIVES
Reliability techniques at the IC Packaging level are different from those at the board/system level. We shall explore the best tools and techniques to use at the IC Packaging Level.
The course is intended to provide experimental and analytical tools to engineers that evaluate the field reliability of discrete semiconductor components. The sub-discipline known as DFR (Design For Reliability) is a vital component of most modern design teams. Achieving a product’s reliability goals requires the proper application of both tools and techniques.
The course covers the basics of component reliability theory and implementation for the design, quality and manufacturing engineer or manager.
Emphasis is placed on learning the proper application of each reliability tool and technique, and also on knowing when to apply each and why. The methodologies used to evaluate the failure rates for the components are based on physics of failure, when statistical tools are used in conjunction to equations describing the expected failure mechanism under use field conditions.
WHO SHOULD ATTEND
This course is intended for those individuals and managers involved in the design, test and/or analysis of discrete semiconductor components, and who wish to acquire a better understanding of current reliability concepts and practices and how their proper application leads directly to better and more reliable products.
OUTLINE
Introduction
- Definitions
- Failure Rates
- FITs and RITs
- Generalized Reliability Mathematics
- Failure Patterns
- System Reliability and Device Failure Rates
- Examples
Life Distributions
- Life Distribution Examples
- Selection of Proper Life Distribution
Failure Mechanisms and Physics of Failure
- Temperature
- Temperature Cycling
- Elevated Temperature and Voltage
- Reduced Temperature and Voltage
- Temperature, Voltage, and Humidity
- Temperature and Current
- Power Cycling
- Radiation
- Electrostatic Discharge (ESD)
- Examples
Test Selection
- Arrhenius Equation
- Eyring Equation
- Test selection based on Physics of Failure
- Chi Square Test
- Accelerated Stress Test
- Accelerated Stress and Acceleration Factors
- Constant Temperature Stress
- Activation Energies
- Overstress Testing (HALT)
- Accelerated Tests and Acceleration Factors
- Temperature Cycling
- Vibration and Shock
- Humidity
- Temperature and Current (Electromigration)
- Voltage (TDDB)
- Electrostatic Discharge (ESD)
- Examples
Data Handling
- Plotting Lognormal/Weibull Distributions
- Confidence Interval Estimate
- Truncated Data
- “S” Curves and Freak Distributions
- Examples
Failure Rate Calculations and Predictions
- Normalized Failure Rate vs. Time Curves
- Early Life Failures
- Failure Rate Calculations for Infant Mortalities and Freak Failures
- Estimation of Infant Mortality Parameters
- “Duane” Growth Plots
- Combined Failure Rate Curves
- Failure Rates from Distributions with Small Standard Deviations
- Examples
Development of Screens and Life Tests
- Reverse Process to Achieve System Life
- Life Test Sample Size
- AQL Plans
- LTPD Plans
- Screening Sensitivity to Failure Mechanisms
- Warranty Considerations
- Materials and Test Equipment Considerations
- Examples
