Food sponsored by
ICE Labs, ISO 9001 & 17025 Reliability Test Lab
Title: Adhesion and Thermomechanical Reliability
Invited Speaker: Prof. Reinhold H. Dauskardt, Professor of Materials Science & Engineering, Stanford University
Time: Check in and food at 6:00PM – 6:30 PM
Presentation from 6:30 PM to 7:30 PM
Location: Qualcomm Inc., 3165 Kifer Rd, Santa Clara, CA, 95051 (Meeting will be in the cafeteria) (View Map)
Admission: Open to all IEEE members and non-members for FREE!
Abstract: Material layers and interfaces in emerging device packaging and flexible electronic technologies operate near the envelope of their mechanical and adhesive properties with remarkably high levels of film stress. Debonding and cohesive fracture are major challenges for device reliability at all levels of processing, packaging and service. The thermomechanical properties of device structures including complex back-end interconnect, emerging 3-D packages, and flexible organic electronic structures are critical for aiding new materials integration as well as understanding device reliability.
For more information and to register, visit: Eventbrite Registration