|October 7, 2015
Food sponsored by
ICE Labs, ISO 9001 & 17025 Reliability Test Lab
Title: Engineering The Right Accelerated Life Tests For Reliability Qualification – Customer use conditions vs. industry standards based approaches
Invited Speaker: Sudarshan Rangaraj, Ph.D, Amazon Lab126 Reliability Manager
Time: Check in and food at 6:00PM – 6:30 PM
Presentation from 6:30 PM to 7:30 PM
Location: Qualcomm Inc., 3165 Kifer Rd, Santa Clara, CA, 95051 (Meeting will be in the cafeteria, Building B)
Admission: Open to all IEEE members and non-members for FREE!
Abstract: Various reliability testing standards like JEDEC/AED/MIL/IEC etc. are commonly used in the semi-conductor and consumer electronics for reliability qualification of IC components and consumer electronics devices. However, “blanket” qualification criteria that are not based on knowledge of customers’ usage behaviors and physics of failure expose the manufacturers to two risks. At one end of the spectrum lies the risk of over-design and added cost while on the other end lie the risks of field failures, warranty costs, negative user experience and erosion of the corporation’s brand. The present talk will draw upon examples from semi-conductor chip/package and consumer electronics to compare qualification criteria based on standards to those based upon product use conditions. Widely prevalent failure modes like moisture diffusion in polymers and fatigue of solders will be invoked to make quantitative comparisons between standards and use conditions based reliability qualification criteria. The talk will take a critical look at JEDEC criteria for temperature-humidity, thermal cycling and bake testing.