August 4, 2016 IEEE Santa Clara Valley Reliability Chapter Meeting Surfaces, Interfaces and Microelectronic Packaging by Dr. Guna Selvaduray, Ph.D. Date: Thursday, August 4, 2016 Time: 6:00pm - 8:00pm 6:00pm - 6:30pm - Check-in 6:30pm - 8:00pm - Presentation Location: Qualcomm Inc., 3165 Kifer Rd, Santa Clara, CA, 95051 (Meeting will be in the cafeteria, Building B) Admission: Open to all IEEE members and non-members for FREE All in-person attendees will receive a light lunch. Breaks with snacks and drinks will be part of the seminar experience. Abstract: Of the total cost involved in producing a microelectronic component, between 50% to 90% goes towards the packaging, depending on the specific type of die and packaging technology. However, approximately 95% of the …
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